Timepix3 Specs for Model

1

I am looking to model a Timepix3 chip and was wondering if these parameters are adequate or if there are any references to most commonly used parameters and their values. I appreciate all the help!

type = "hybrid"
geometry = "pixel"

number_of_pixels = 256 256
pixel_size = 55um 55um

sensor_thickness = 2000um
sensor_excess = 1mm
sensor_material = CADMIUM_TELLURIDE

bump_sphere_radius = 9.0um
bump_cylinder_radius = 7.0um
bump_height = 20.0um

chip_thickness = 100um
chip_excess_top = 1610um
chip_excess_bottom = 1610um
chip_excess_right = 10um
chip_excess_left = 10um
Detector Parameter​ *Timepix3 MT3-F10-XCB ​
Number of Pixels*​ 256x256​
Pixel Size*​ 55um​
Sensor Thickness*​ 2000um​
Bump Bond Sphere Radius​ 9um​
Bump Cylinder Radius​ 7um​
Bump Height​ 20um​
Silicon Chip Thickness​ 300um​
Chip Excess Top​ 100um​
Chip Excess Bottom​ 1610um​
Chip Excess Right​ 10um​
Chip Excess Left​ 10um​
2

Hi @oobie2142 ,

This looks okay. We have example models for both Timepix3 (timepix.conf) and TImepix4 (timepix4.conf) in the models directory.
Your chip thickness looks a bit low maybe, but these ASICs can be thinned, and maybe yours are.

One of the main things is to know your sensor very well, the thickness of this will impact your simulation a lot. But apart from what I mentioned, from the Timepix side and bonds and such this looks okay as far as I know!

Kind regards,
Håkan

3

Thanks @hwennlof I appreciate it, I will build my detector off the model in the installation directory!